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| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NC3SW.020 1LBSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
7 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
NC191AX250T5SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
3 |
|
Таблицы данных |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC3SWLF.031 1LBLF SOLDER WIRE 96.5/3.5 TIN/SILV Chip Quik Inc. |
9 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.031" (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMD2200SOLDER SPHERES 63/37 .024 DIAM Chip Quik Inc. |
7 |
|
Таблицы данных |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.024" (0.61mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
NC3SWLF.020 1LBLF SOLDER WIRE 96.5/3.5 TIN/SILV Chip Quik Inc. |
4 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
NCSWLF.020 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
4 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMD2185SOLDER SPHERES SN63/PB37 .018" ( Chip Quik Inc. |
11 |
|
Таблицы данных |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.018" (0.46mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
RASWLF.031 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
5 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMDSWLF.031 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
4 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMDSWLF.020 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
8 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
