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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    44-6556-40

    44-6556-40

    CONN IC DIP SOCKET 44POS GOLD

    Aries Electronics

    0
    RFQ
    44-6556-40

    Таблицы данных

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    40-6556-41

    40-6556-41

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    0
    RFQ
    40-6556-41

    Таблицы данных

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    110-33-628-41-001000

    110-33-628-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    210-33-628-41-001000

    210-33-628-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ
    210-33-628-41-001000

    Таблицы данных

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    550-10-432M31-001152

    550-10-432M31-001152

    BGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-10-432M31-001152

    Таблицы данных

    550 Bulk Active BGA 432 (31 x 31) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    32-3575-16

    32-3575-16

    CONN IC DIP SOCKET ZIF 32POS

    Aries Electronics

    0
    RFQ
    32-3575-16

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    179-PGM15011-10H

    179-PGM15011-10H

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    179-PGM15011-10H

    Таблицы данных

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    558-10-388M26-001104

    558-10-388M26-001104

    BGA SURFACE MOUNT 1.27MM

    Preci-Dip

    0
    RFQ
    558-10-388M26-001104

    Таблицы данных

    558 Bulk Active BGA 388 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    514-87-600M35-001148

    514-87-600M35-001148

    CONN SOCKET BGA 600POS GOLD

    Preci-Dip

    0
    RFQ
    514-87-600M35-001148

    Таблицы данных

    514 Bulk Active BGA 600 (35 x 35) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    518-77-388M26-001105

    518-77-388M26-001105

    CONN SOCKET PGA 388POS GOLD

    Preci-Dip

    0
    RFQ
    518-77-388M26-001105

    Таблицы данных

    518 Bulk Active PGA 388 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
    32-6575-16

    32-6575-16

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    0
    RFQ
    32-6575-16

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    HLS-1012-G-10

    HLS-1012-G-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-1012-G-10

    Таблицы данных

    HLS Bulk Active SIP 120 (10 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    210-33-632-41-001000

    210-33-632-41-001000

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ
    210-33-632-41-001000

    Таблицы данных

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Thermoplastic -55°C ~ 125°C
    48-6556-40

    48-6556-40

    CONN IC DIP SOCKET 48POS GOLD

    Aries Electronics

    0
    RFQ
    48-6556-40

    Таблицы данных

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    546-83-503-22-131147

    546-83-503-22-131147

    CONN SOCKET PGA 503POS GOLD

    Preci-Dip

    0
    RFQ
    546-83-503-22-131147

    Таблицы данных

    546 Bulk Active PGA 503 (22 x 22) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    40-6570-16

    40-6570-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    0
    RFQ
    40-6570-16

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-6571-16

    40-6571-16

    CONN IC DIP SOCKET ZIF 40POS

    Aries Electronics

    0
    RFQ
    40-6571-16

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
    40-6572-16

    40-6572-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    0
    RFQ
    40-6572-16

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6573-16

    40-6573-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    0
    RFQ
    40-6573-16

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6575-16

    40-6575-16

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    0
    RFQ
    40-6575-16

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
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