| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | 264-4493-00-0602JCONN IC DIP SOCKET ZIF 64POS GLD | 37 |  |   Таблицы данных | Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | 
|   | 225-PRS15001-12CONN SOCKET PGA ZIF GOLD | 30 |  |   Таблицы данных | PRS | Bulk | Active | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 
|   | 289-PRS17001-12CONN SOCKET PGA ZIF GOLD | 34 |  |   Таблицы данных | PRS | Bulk | Active | PGA, ZIF (ZIP) | - | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C | 
|   | 240-5205-01CONN SOCKET QFN 40POS GOLD | 27 |  |   Таблицы данных | Textool™ | Bulk | Active | QFN | 40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) | - | 
|  | ICS-306-TIC SOCKET, DIP, 6P 2.54MM PITCH | 7,748 |  |   Таблицы данных | ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C | 
|  | ICS-308-TIC SOCKET, DIP, 8P 2.54MM PITCH | 10,424 |  |   Таблицы данных | ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C | 
|  | ICS-314-TIC SOCKET, DIP, 14P 2.54MM PITCH | 2,629 |  |   Таблицы данных | ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C | 
|  | ICS-316-TIC SOCKET, DIP, 16P 2.54MM PITCH | 21,453 |  |   Таблицы данных | ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C | 
|  | ICS-318-TIC SOCKET, DIP, 18P 2.54MM PITCH | 9,810 |  |   Таблицы данных | ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C | 
|  | ED14DTCONN IC DIP SOCKET 14POS TIN | 10,684 |  |   Таблицы данных | ED | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 110°C | 
|  | ICS-320-TIC SOCKET, DIP, 20P 2.54MM PITCH | 9,010 |  |   Таблицы данных | ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C | 
|   | A 08-LC-TRCONN IC DIP SOCKET 8POS TIN | 4,012 |  |   Таблицы данных | - | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT) | -55°C ~ 85°C | 
|   | AR 06-HZL-TTCONN IC DIP SOCKET 6POS TIN | 5,612 |  |   Таблицы данных | - | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C | 
|   | 245-08-1-03CONN IC DIP SOCKET 8POS TIN | 3,915 |  |   Таблицы данных | - | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole, Kinked Pin | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C | 
|  | ICS-324-TIC SOCKET, DIP, 24P 2.54MM PITCH | 1,884 |  |   Таблицы данных | ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C | 
|   | 1-2199298-1CONN IC DIP SOCKET 6POS TIN | 6,487 |  |   Таблицы данных | Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C | 
|   | 1-2199298-3CONN IC DIP SOCKET 14POS TIN | 8,658 |  |   Таблицы данных | Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass, Copper | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C | 
|  | DILB8P-223TLFCONN IC DIP SOCKET 8POS TIN | 3,490 |  |   Таблицы данных | - | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon | -55°C ~ 105°C | 
|  | ED40DTCONN IC DIP SOCKET 40POS TIN | 0 |  |   Таблицы данных | ED | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 110°C | 
|  | ICS-328-TIC SOCKET, DIP, 28P 2.54MM PITCH | 3,016 |  |   Таблицы данных | ICS | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |