| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | 110-43-628-41-001000CONN IC DIP SOCKET 28POS GOLD | 1,110 |  |   Таблицы данных | 110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | 
|   | 25-0513-10CONN SOCKET SIP 25POS GOLD | 304 |  |   Таблицы данных | 0513 | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 
|   | 40-0518-10CONN SOCKET SIP 40POS GOLD | 2,062 |  |   Таблицы данных | 518 | Bulk | Active | SIP | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 
|  | 110-43-632-41-001000CONN IC DIP SOCKET 32POS GOLD | 984 |  |   Таблицы данных | 110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | 
|   | 110-93-640-41-001000CONN IC DIP SOCKET 40POS GOLD | 653 |  |   Таблицы данных | 110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | 
|   | 110-13-628-41-001000CONN IC DIP SOCKET 28POS GOLD | 1,430 |  |   Таблицы данных | 110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | 
|   | 40-6518-10CONN IC DIP SOCKET 40POS GOLD | 717 |  |   Таблицы данных | 518 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 
|  | D01-9953242CONN SOCKET SIP 32POS GOLD | 1,247 |  |   Таблицы данных | D01-995 | Bulk | Active | SIP | 32 (1 x 32) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 196.9µin (5.00µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C | 
|   | 299-43-314-10-001000CONN IC DIP SOCKET 14POS GOLD | 367 |  |   Таблицы данных | 299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | 
|  | TDU03DTONCONN SOCKET TRANSIST 3POS GOLD | 262 |  |   Таблицы данных | - | Tray | Active | Transistor | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Board Guide | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -55°C ~ 175°C | 
|  | TDU03DTODCONN SOCKET TRANSIST 3POS GOLD | 213 |  |   Таблицы данных | - | Tray | Active | Transistor | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Board Guide, Flange | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -55°C ~ 175°C | 
|   | 714-43-164-31-018000CONN SOCKET SIP 64POS GOLD | 223 |  |   Таблицы данных | 714 | Tube | Active | SIP | 64 (1 x 64) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | 
|   | 28-6554-11CONN IC DIP SOCKET ZIF 28POS GLD | 145 |  |   Таблицы данных | 55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - | 
|   | 214-3339-00-0602JCONN IC DIP SOCKET ZIF 14POS GLD | 312 |  |   Таблицы данных | Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | 
|   | 224-1275-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD | 199 |  |   Таблицы данных | Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | 
|   | 216-3340-00-0602JCONN IC DIP SOCKET ZIF 16POS GLD | 565 |  |   Таблицы данных | Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | 
|  | 208-7391-55-1902CONN SOCKET SOIC 8POS GOLD | 298 |  |   Таблицы данных | Textool™ | Bulk | Active | SOIC | 8 (2 x 4) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C | 
|  | 248-1282-00-0602JCONN IC DIP SOCKET ZIF 48POS GLD | 614 |  |   Таблицы данных | Textool™ | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C | 
|  | 216-7224-55-1902CONN SOCKET SOIC 16POS GOLD | 228 |  |   Таблицы данных | Textool™ | Bulk | Active | SOIC | 16 (2 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled | -55°C ~ 150°C | 
|   | 203-2737-55-1102CONN TRANSIST TO-3/TO-66 3POS | 72 |  |   Таблицы данных | Textool™ | Bulk | Active | Transistor, TO-3 and TO-66 | 3 (Rectangular) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.234" (5.94mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 150°C |