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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    APH-1618-T-H

    APH-1618-T-H

    APH-1618-T-H

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    ICO-628-ZNGT

    ICO-628-ZNGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-628-ZNGT

    Таблицы данных

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    32-6513-11H

    32-6513-11H

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    RFQ
    32-6513-11H

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-6810-90TWR

    12-6810-90TWR

    CONN IC DIP SOCKET 12POS TIN

    Aries Electronics

    0
    RFQ
    12-6810-90TWR

    Таблицы данных

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    346-93-136-41-013000

    346-93-136-41-013000

    CONN SOCKET SIP 36POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-93-136-41-013000

    Таблицы данных

    346 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-136-41-013000

    346-43-136-41-013000

    CONN SOCKET SIP 36POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-43-136-41-013000

    Таблицы данных

    346 Bulk Active SIP 36 (1 x 36) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-83-180-18-111101

    510-83-180-18-111101

    CONN SOCKET PGA 180POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-180-18-111101

    Таблицы данных

    510 Bulk Active PGA 180 (18 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-3508-20

    20-3508-20

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-3508-20

    Таблицы данных

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    24-6518-01

    24-6518-01

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    RFQ
    24-6518-01

    Таблицы данных

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    16-81250-610C

    16-81250-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-81250-610C

    Таблицы данных

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8300-610C

    16-8300-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-8300-610C

    Таблицы данных

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8350-610C

    16-8350-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-8350-610C

    Таблицы данных

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8400-610C

    16-8400-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-8400-610C

    Таблицы данных

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8540-610C

    16-8540-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-8540-610C

    Таблицы данных

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8625-610C

    16-8625-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-8625-610C

    Таблицы данных

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-8700-610C

    16-8700-610C

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-8700-610C

    Таблицы данных

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-83-175-15-061101

    510-83-175-15-061101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-175-15-061101

    Таблицы данных

    510 Bulk Active PGA 175 (15 x 15) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-175-16-001101

    510-83-175-16-001101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-175-16-001101

    Таблицы данных

    510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-175-16-071101

    510-83-175-16-071101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-175-16-071101

    Таблицы данных

    510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-175-16-072101

    510-83-175-16-072101

    CONN SOCKET PGA 175POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-175-16-072101

    Таблицы данных

    510 Bulk Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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