| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|   | 2-1571586-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 800 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C | 
|   | 2-1571551-9CONN IC DIP SOCKET 28POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | 
|   | 524-AG11D-ESLCONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors | 259 |  |   Таблицы данных | 500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C | 
|   | 1-1825376-3CONN IC DIP SOCKET 40POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C | 
|  | 808-AG10DCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Polyester | -55°C ~ 105°C | 
|  | 820-AG11DCONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C | 
|   | 6-1437537-66-1437537-6 TE Connectivity AMP Connectors | 9,007 |  |   Таблицы данных | * | Box | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 
|  | 2134928-2CONN SOCKET LGA 1150POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | - | Bulk | Obsolete | LGA | 1150 | 0.036" (0.91mm) | Gold | 3.90µin (0.099µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.036" (0.91mm) | - | - | - | Thermoplastic | - | 
|   | 1-1814655-3CONN SOCKET SIP 20POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | - | Bulk | Obsolete | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C | 
|   | 2-1571586-8CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 105°C |