| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|  | 514-AG11D-ESCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | - | Copper Alloy | Polyester | -55°C ~ 125°C | 
|   | 643642-8CONN SOCKET SIP 10POS TIN TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | Diplomate DL | Tray | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled | -55°C ~ 105°C | 
|  | 508-AG11D-ESCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C | 
|   | 1-1825094-3CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C | 
|   | 2-1571551-2CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | 
|   | 2-1571550-2CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C | 
|   | 1-1825094-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 125°C | 
|  | 2-640361-4CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Beryllium Copper | Thermoplastic | -55°C ~ 125°C | 
|  | 1-1571995-0CONN SOCKET SIP 10POS TIN TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 510 | Tube | Obsolete | SIP | 10 (2 x 5) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester | - | 
|   | 816-AG11D-ESCONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors | 0 |  |   Таблицы данных | 800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |