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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    110-87-322-41-005101

    110-87-322-41-005101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-322-41-005101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    09-0513-10T

    09-0513-10T

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    0
    RFQ
    09-0513-10T

    Таблицы данных

    0513 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    08-0518-11

    08-0518-11

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-0518-11

    Таблицы данных

    518 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    122-87-310-41-001101

    122-87-310-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    122-87-310-41-001101

    Таблицы данных

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS052-Z-SM/T

    A-CCS052-Z-SM/T

    SOCKET

    Assmann WSW Components

    0
    RFQ
    A-CCS052-Z-SM/T

    Таблицы данных

    - Bulk Active PLCC 52 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) - - - Polyphenylene Sulfide (PPS), Glass Filled -40°C ~ 105°C
    AR18-HZW/T

    AR18-HZW/T

    CONN IC DIP SOCKET 18POS GOLD

    Assmann WSW Components

    0
    RFQ
    AR18-HZW/T

    Таблицы данных

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    0473370001

    0473370001

    CONN CAM SOCKET 24POS GOLD

    Molex

    0
    RFQ
    0473370001

    Таблицы данных

    47337 Tape & Reel (TR) Obsolete Camera Socket 24 (4 x 6) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Gold Flash Copper Alloy Polyamide (PA), Nylon -55°C ~ 85°C
    410-87-220-10-001101

    410-87-220-10-001101

    CONN ZIG-ZAG 20POS GOLD

    Preci-Dip

    0
    RFQ
    410-87-220-10-001101

    Таблицы данных

    410 Bulk Active Zig-Zag, Left Stackable 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-87-220-10-002101

    410-87-220-10-002101

    CONN ZIG-ZAG 20POS GOLD

    Preci-Dip

    0
    RFQ
    410-87-220-10-002101

    Таблицы данных

    410 Bulk Active Zig-Zag, Right Stackable 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-320-41-117101

    114-87-320-41-117101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    114-87-320-41-117101

    Таблицы данных

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-320-41-134161

    114-87-320-41-134161

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    114-87-320-41-134161

    Таблицы данных

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-314-41-001101

    115-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-310-41-035101

    146-87-310-41-035101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    146-87-310-41-035101

    Таблицы данных

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-310-41-036101

    146-87-310-41-036101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    146-87-310-41-036101

    Таблицы данных

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D01-9972142

    D01-9972142

    CONN SOCKET SIP 21POS GOLD

    Harwin Inc.

    0
    RFQ
    D01-9972142

    Таблицы данных

    D01-997 Tube Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    212-1-08-003

    212-1-08-003

    CONN IC DIP SOCKET 8POS GOLD

    CNC Tech

    0
    RFQ
    212-1-08-003

    Таблицы данных

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -40°C ~ 105°C
    116-87-210-41-008101

    116-87-210-41-008101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-210-41-008101

    Таблицы данных

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-310-41-008101

    116-87-310-41-008101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-310-41-008101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-610-41-018101

    116-83-610-41-018101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-610-41-018101

    Таблицы данных

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-316-41-001101

    110-83-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-316-41-001101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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