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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    110-83-314-41-005101

    110-83-314-41-005101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-314-41-005101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-314-41-605101

    110-83-314-41-605101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-314-41-605101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-316-41-001101

    614-87-316-41-001101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ
    614-87-316-41-001101

    Таблицы данных

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-018101

    116-87-314-41-018101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-314-41-018101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-308-41-007101

    116-83-308-41-007101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-308-41-007101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-316-01-931101

    110-83-316-01-931101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-316-01-931101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0104-T-2

    HLS-0104-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0104-T-2

    Таблицы данных

    HLS Tube Active SIP 4 (1 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-87-428-41-001101

    110-87-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-428-41-001101

    Таблицы данных

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-210-41-018101

    116-87-210-41-018101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-210-41-018101

    Таблицы данных

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-310-41-134191

    114-83-310-41-134191

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    114-83-310-41-134191

    Таблицы данных

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-310-41-018101

    116-83-310-41-018101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-310-41-018101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    07-0513-10T

    07-0513-10T

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    0
    RFQ
    07-0513-10T

    Таблицы данных

    0513 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    0784990002

    0784990002

    CONN CAM SOCKET 24POS GOLD

    Molex

    0
    RFQ
    0784990002

    Таблицы данных

    78499 Tape & Reel (TR) Obsolete Camera Socket 24 (2 x 4, 2 x 8) 0.024" (0.60mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Closed Frame Solder 0.024" (0.60mm) Gold Flash Copper Alloy Plastic -55°C ~ 85°C
    08-3513-10

    08-3513-10

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-3513-10

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    SIP050-1X13-160B

    SIP050-1X13-160B

    1X13-160B-SIP SOCKET 13 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X13-160B

    Таблицы данных

    SIP050-1x Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    110-87-424-41-005101

    110-87-424-41-005101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-424-41-005101

    Таблицы данных

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-99-032-17-400200

    540-99-032-17-400200

    CONN SOCKET PLCC 32POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    540-99-032-17-400200

    Таблицы данных

    540 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    540-99-028-24-000000

    540-99-028-24-000000

    CONN SOCKET PLCC 28POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    540-99-028-24-000000

    Таблицы данных

    540 Tube Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) - Polyphenylene Sulfide (PPS) -
    AR 50-HGL-TT

    AR 50-HGL-TT

    SOCKET

    Assmann WSW Components

    0
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ED032PLCZ

    ED032PLCZ

    CONN SOCKET PLCC 32POS TIN

    On Shore Technology Inc.

    0
    RFQ
    ED032PLCZ

    Таблицы данных

    ED Tube Active PLCC 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 105°C
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