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| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WS991AX35T4THERMALLY STABLE SOLDER PASTE WS Chip Quik Inc. |
1 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
TS991AX35T4THERMALLY STABLE SOLDER PASTE NC Chip Quik Inc. |
5 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
SMD2SWLF.015 8OZLF SOLDER WIRE 99.3/0.7 TIN/COPP Chip Quik Inc. |
4 |
|
Таблицы данных |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
RASW.031 1LBSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
2 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | - |
|
SMDSW.020 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL Chip Quik Inc. |
4 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
RASW.020 1LBSOLDER WIRE 63/37 TIN/LEAD ROSIN Chip Quik Inc. |
2 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
TS991SNL35T4THERMALLY STABLE SOLDER PASTE NC Chip Quik Inc. |
5 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
WS991SNL35T4THERMALLY STABLE SOLDER PASTE WS Chip Quik Inc. |
1 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
NC191AX250SMOOTH FLOW LEADED SOLDER PASTE Chip Quik Inc. |
3 |
|
Таблицы данных |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD3SW.031 8OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
3 |
|
Таблицы данных |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
