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| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD-SC-SAC405-0.031-1OZSN95.5/AG4.0/CU0.5 .031" SOLDER Chip Quik Inc. |
41 |
|
Таблицы данных |
SMD | Bulk | Active | Wire Solder | Sn95.5Ag4Cu0.5 (95.5/4/0.5) | 0.031" (0.79mm) | 423°F (217°C) | - | - | - | Lead Free | Spool | 60 Months | - | - |
|
|
EXLB-SN63PB37SOLDER BAR SN63/PB37 1LB (454G) Chip Quik Inc. |
98 |
|
Таблицы данных |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar | - | Date of Manufacture | - |
|
|
SMDSN90AU10-2FTSOLDER WIRE (SN90/AU10) TIN/GOLD Chip Quik Inc. |
12 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn90Au10 (90/10) | 0.016" (0.40mm) | 423°F (217°C) | - | - | - | Lead Free | Spool | 60 Months | Date of Manufacture | - |
|
|
CQ-SS-SAC405-0.30MM-25000SOLDER SPHERES SN95.5/AG4.0/CU0. Chip Quik Inc. |
19 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Sphere | Sn95.5Ag4Cu0.5 (95.5/4/0.5) | 0.012" (0.31mm) | 423°F (217°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
|
CQ-SS-SAC405-0.60MM-25000SOLDER SPHERES SN95.5/AG4.0/CU0. Chip Quik Inc. |
19 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Sphere | Sn95.5Ag4Cu0.5 (95.5/4/0.5) | 0.024" (0.61mm) | 423°F (217°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
|
WS991LT500T4CTHERMALLY STABLE SOLDER PASTE WS Chip Quik Inc. |
2 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn42Bi57.6Ag0.4 (42/57.6/0.4) | - | 280°F (138°C) | Water Soluble | - | - | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
|
CQ-SS-SAC405-0.50MM-25000SOLDER SPHERES SN95.5/AG4.0/CU0. Chip Quik Inc. |
18 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Sphere | Sn95.5Ag4Cu0.5 (95.5/4/0.5) | 0.020" (0.51mm) | 423°F (217°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
|
CQ-SS-6040-0.76MMSOLDER SPHERES SN60/PB40 0.76MM Chip Quik Inc. |
4 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Sphere | Sn60Pb40 (60/40) | - | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
|
EXLB-SN63PB37-20LBSOLDER BAR SN63/PB37 20LBS (9.08 Chip Quik Inc. |
2 |
|
Таблицы данных |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn63Pb37 (63/37) | - | 361°F (183°C) | - | - | - | Leaded | Bar | - | Date of Manufacture | - |
|
SMD291AX50T3SLDR PASTE NO-CLN SN63/PB37 50G Chip Quik Inc. |
0 |
|
Таблицы данных |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
