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| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDSWLT.040 10GSN42/BI57/AG1 2.2 FLUX CORE SOLD Chip Quik Inc. |
10 |
|
Таблицы данных |
SMD | Bulk | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | 18 AWG, 19 SWG | - | Lead Free | Spool, 0.35 oz (10g) | - | - | - |
|
SMDLTLFP15T4TWO PART MIX SOLDER PASTE Chip Quik Inc. |
7 |
|
Таблицы данных |
- | Bulk | Active | Solder Paste, Two Part Mix | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 0.53 oz (15g) | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
SMDSWLF.006 2GSOLDER WIRE SN96.5/AG3/CU0.5 Chip Quik Inc. |
16 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.07 oz (2g) | - | - | - |
|
EXB-SN99.3CU0.7-0.5LBSOLDER BAR SN99.3/CU0.7 0.5LB (2 Chip Quik Inc. |
26 |
|
Таблицы данных |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | - | 441°F (227°C) | - | - | - | Lead Free | Bar, 0.5 lb (227g) | - | - | - |
|
SMD3SW.020 2OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL Chip Quik Inc. |
6 |
|
Таблицы данных |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 2 oz (56.70g) | - | - | - |
|
SMD2165-25000SOLDER SPHERES SN63/PB37 .012" D Chip Quik Inc. |
6 |
|
Таблицы данных |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.012" (0.31mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
SMD291SNL15T4SOLDER PASTE TWO PART MIX Chip Quik Inc. |
15 |
|
Таблицы данных |
- | Bulk | Active | Solder Paste, Two Part Mix | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 0.53 oz (15g) | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
SMDLTLFP50T3SLDR PASTE NO-CLN SN42/BI58 50G Chip Quik Inc. |
16 |
|
Таблицы данных |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
RASWLF.020 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI Chip Quik Inc. |
42 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMD2060-25000SOLDER SPHERES SAC305 .030" DIAM Chip Quik Inc. |
11 |
|
Таблицы данных |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.030" (0.76mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
