БОМ
Припой
| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
39546760/40 370 5C 1.22MM 0.5KG AM |
5 |
|
Таблицы данных |
370 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.048" (1.22mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | - |
|
BARSN42BI57AG1SOLDER BAR SN42/BI57/AG1 1LB SUP |
17 |
|
Таблицы данных |
Super Low Dross™ | Bulk | Active | Bar Solder | Bi57Sn42Ag1 (57/42/1) | - | 280°F (138°C) | - | - | - | Lead Free | Bar, 1 lb (454g) | - | - | - |
|
TS391AX250THERMALLY STABLE SOLDER PASTE NO |
2 |
|
Таблицы данных |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
38692763/37 400 2% .032DIA 20AWG |
9 |
|
Таблицы данных |
C400 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
SMD4300SNL250T3SOLDER PASTE SAC305 250G T3 |
5 |
|
Таблицы данных |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 3 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
T0051388799WSW SAC L0 SN3,0AG0,5CU3,5% |
6 |
|
Таблицы данных |
Weller® | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | - | No-Clean | - | - | Lead Free | Spool, 8.8 oz (250g) | - | - | - |
|
38682460/40 370 3% .024DIA 22AWG |
6 |
|
Таблицы данных |
370 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.024" (0.61mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | - |
|
SMDSWLF.031 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
10 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
RASWLF.031 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
5 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
SMDSWLF.020 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
9 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
NC191SNL250SMOOTH FLOW LEAD-FREE SOLDER PAS |
6 |
|
Таблицы данных |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LT250SMOOTH FLOW LOW TEMP SOLDER PAST |
3 |
|
Таблицы данных |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 4 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDSWLF.015 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
12 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
4865-454GSOLDER NO-CLEAN 63/37 1 LB |
22 |
|
Таблицы данных |
4860 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
4886-454GSOLDER RA 63/37 1 LB |
10 |
|
Таблицы данных |
4880 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.040" (1.02mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
4898-454GSOLDER RA 60/40 .062" 1 LB |
8 |
|
Таблицы данных |
4890 | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
CQ100GE.031 1LBGERMANIUM DOPED SOLDER WIRE SN/C |
19 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean | - | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
SMD2SWLF.031 1LBLF SOLDER WIRE 99.3/0.7 TIN/COPP |
7 |
|
Таблицы данных |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
|
|
SMDLTLFPT6SOLDER PASTE NO CLEAN SN42/BI57. |
9 |
|
Таблицы данных |
CHIPQUIK® | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | - | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
CQ100GE.020 1LBGERMANIUM DOPED SOLDER WIRE SN/C |
8 |
|
Таблицы данных |
- | Bulk | Active | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean | - | - | Lead Free | Spool, 1 lb (454 g) | - | - | - |
