Гнезда для ИС

    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    03-0518-10H

    03-0518-10H

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    0
    RFQ
    03-0518-10H

    Таблицы данных

    518 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    115-87-308-41-003101

    115-87-308-41-003101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    RFQ
    115-87-308-41-003101

    Таблицы данных

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X06-157B

    SIP050-1X06-157B

    1X06-157B-SIP SOCKET 6 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X06-157B

    Таблицы данных

    SIP050-1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    110-87-310-41-005101

    110-87-310-41-005101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-310-41-005101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-012-05-001101

    510-87-012-05-001101

    CONN SOCKET PGA 12POS GOLD

    Preci-Dip

    0
    RFQ
    510-87-012-05-001101

    Таблицы данных

    510 Bulk Active PGA 12 (5 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-304-31-012101

    614-83-304-31-012101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ
    614-83-304-31-012101

    Таблицы данных

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    245-22-1-03

    245-22-1-03

    CONN IC DIP SOCKET 22POS TIN

    CNC Tech

    0
    RFQ
    245-22-1-03

    Таблицы данных

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    SIP050-1X05-160B

    SIP050-1X05-160B

    1X05-160B-SIP SOCKET 5 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X05-160B

    Таблицы данных

    SIP050-1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    115-87-308-41-001101

    115-87-308-41-001101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    940-99-032-17-400000

    940-99-032-17-400000

    CONN SOCKET PLCC 32POS TIN-LEAD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    940-99-032-17-400000

    Таблицы данных

    940 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-83-306-41-001101

    110-83-306-41-001101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-306-41-001101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-312-41-001101

    110-87-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-312-41-001101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A-CCS32-Z

    A-CCS32-Z

    CONN SOCKET PLCC 32POS TIN

    Assmann WSW Components

    0
    RFQ
    A-CCS32-Z

    Таблицы данных

    - Bag Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    DIP316-011B

    DIP316-011B

    DIP SOCKET 16 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    DIP316-011B

    Таблицы данных

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    A08-LCG-T-R

    A08-LCG-T-R

    CONN IC DIP SOCKET 8POS GOLD

    Assmann WSW Components

    0
    RFQ
    A08-LCG-T-R

    Таблицы данных

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold - - Through Hole Open Frame Solder 0.100" (2.54mm) Gold - - Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    A-CCS28-Z

    A-CCS28-Z

    CONN SOCKET PLCC 28POS TIN

    Assmann WSW Components

    0
    RFQ
    A-CCS28-Z

    Таблицы данных

    - Bag Obsolete PLCC 28 (4 x 7) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    AW 127-22/Z-T

    AW 127-22/Z-T

    SOCKET 22 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    RFQ
    AW 127-22/Z-T

    Таблицы данных

    - - Active - - - - - - - - - - - - - - -
    A 22-LC-TT

    A 22-LC-TT

    IC-SOCKETS

    Assmann WSW Components

    0
    RFQ

    -

    - Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    146-87-304-41-035101

    146-87-304-41-035101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ
    146-87-304-41-035101

    Таблицы данных

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X02-041B

    SIP1X02-041B

    SIP1X02-041B-SIP SOCKET 2 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP1X02-041B

    Таблицы данных

    SIP1x Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    Общий 19086 Записывать«Предыдущая1... 8788899091929394...955Следующий»
    HOME

    ДОМ

    PRODUCT

    ПРОДУКТ

    PHONE

    ТЕЛЕФОН

    USER

    ПОЛЬЗОВАТЕЛЬ