Гнезда для ИС

    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    ICO-486-S8A-T

    ICO-486-S8A-T

    CONN IC DIP SOCKET 48POS TIN

    3M

    0
    RFQ
    ICO-486-S8A-T

    Таблицы данных

    ICO Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
    ICO-486-S8-T

    ICO-486-S8-T

    CONN IC DIP SOCKET 48POS TIN

    3M

    0
    RFQ
    ICO-486-S8-T

    Таблицы данных

    ICO Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
    AR08-HZL-TT

    AR08-HZL-TT

    CONN IC DIP SOCKET 8POS TIN

    Assmann WSW Components

    0
    RFQ
    AR08-HZL-TT

    Таблицы данных

    - Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    AW 127-04/Z-T

    AW 127-04/Z-T

    SOCKET 4 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    RFQ
    AW 127-04/Z-T

    Таблицы данных

    - - Active - - - - - - - - - - - - - - -
    SIP1X05-011B

    SIP1X05-011B

    SIP1X05-011B-SIP SOCKET 5 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP1X05-011B

    Таблицы данных

    SIP1x Bulk Active SIP 5 (1 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    115-87-304-41-001101

    115-87-304-41-001101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AW 127-09/Z-T

    AW 127-09/Z-T

    SOCKET 9 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    RFQ
    AW 127-09/Z-T

    Таблицы данных

    - - Active - - - - - - - - - - - - - - -
    DIP308-014B

    DIP308-014B

    DIP SOCKET 8 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    DIP308-014B

    Таблицы данных

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    114-87-304-41-117101

    114-87-304-41-117101

    CONN IC DIP SOCKET 4POS GOLD

    Preci-Dip

    0
    RFQ
    114-87-304-41-117101

    Таблицы данных

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-426-S8A-T

    ICO-426-S8A-T

    CONN IC DIP SOCKET 42POS TIN

    3M

    0
    RFQ
    ICO-426-S8A-T

    Таблицы данных

    ICO Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
    ICO-426-S8-T

    ICO-426-S8-T

    CONN IC DIP SOCKET 42POS TIN

    3M

    0
    RFQ
    ICO-426-S8-T

    Таблицы данных

    ICO Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polyester, Glass Filled -65°C ~ 105°C
    AR 06 HGL-TT

    AR 06 HGL-TT

    SOCKET

    Assmann WSW Components

    0
    RFQ
    AR 06 HGL-TT

    Таблицы данных

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    DIP308-011B

    DIP308-011B

    DIP SOCKET 8 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    DIP308-011B

    Таблицы данных

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    SIP1X06-014B

    SIP1X06-014B

    SIP1X06-014B-SIP SOCKET 6 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP1X06-014B

    Таблицы данных

    SIP1x Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    WMS-080Z

    WMS-080Z

    CONN IC DIP SOCKET 8POS GOLD

    On Shore Technology Inc.

    0
    RFQ
    WMS-080Z

    Таблицы данных

    WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass - -40°C ~ 105°C
    DIP306-001B

    DIP306-001B

    SOCKET 6 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    DIP306-001B

    Таблицы данных

    - Bag Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    01-0513-10

    01-0513-10

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    0
    RFQ
    01-0513-10

    Таблицы данных

    0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    01-0513-10T

    01-0513-10T

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    0
    RFQ
    01-0513-10T

    Таблицы данных

    0513 Bulk Active SIP 1 (1 x 1) - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    01-0518-10

    01-0518-10

    CONN SOCKET SIP 1POS GOLD

    Aries Electronics

    0
    RFQ
    01-0518-10

    Таблицы данных

    518 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    SIP050-1X03-157B

    SIP050-1X03-157B

    1X03-157B-SIP SOCKET 3 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X03-157B

    Таблицы данных

    SIP050-1x Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
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