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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    115-93-424-61-003000

    115-93-424-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    115 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-93-636-41-003000

    126-93-636-41-003000

    CONN IC DIP SOCKET 36POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    126-93-636-41-003000

    Таблицы данных

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-636-41-003000

    126-43-636-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    126-43-636-41-003000

    Таблицы данных

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-950-41-007000

    116-93-950-41-007000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-93-950-41-007000

    Таблицы данных

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-950-41-007000

    116-43-950-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-43-950-41-007000

    Таблицы данных

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-41-652-41-003000

    612-41-652-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    612-41-652-41-003000

    Таблицы данных

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    612-91-652-41-003000

    612-91-652-41-003000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    612-91-652-41-003000

    Таблицы данных

    612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-13-648-41-780000

    104-13-648-41-780000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    104-13-648-41-780000

    Таблицы данных

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    33-0511-11

    33-0511-11

    CONN SOCKET SIP 33POS GOLD

    Aries Electronics

    0
    RFQ
    33-0511-11

    Таблицы данных

    511 Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    104-13-652-41-770000

    104-13-652-41-770000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    104-13-652-41-770000

    Таблицы данных

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    28-3503-21

    28-3503-21

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-3503-21

    Таблицы данных

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    28-3503-31

    28-3503-31

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-3503-31

    Таблицы данных

    503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    40-526-11

    40-526-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    0
    RFQ
    40-526-11

    Таблицы данных

    Lo-PRO®file, 526 Bulk Active DIP, ZIF (ZIP) 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-44-322-61-001000

    110-44-322-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-44-422-61-001000

    110-44-422-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-93-306-61-003000

    115-93-306-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    514-87-192M16-001148

    514-87-192M16-001148

    CONN SOCKET BGA 192POS GOLD

    Preci-Dip

    0
    RFQ
    514-87-192M16-001148

    Таблицы данных

    514 Bulk Active BGA 192 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-648-WGG-2

    ICA-648-WGG-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-648-WGG-2

    Таблицы данных

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    117-43-620-61-005000

    117-43-620-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    85-PGM11008-11

    85-PGM11008-11

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    85-PGM11008-11

    Таблицы данных

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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