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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    64-9518-11H

    64-9518-11H

    CONN IC DIP SOCKET 64POS GOLD

    Aries Electronics

    0
    RFQ
    64-9518-11H

    Таблицы данных

    518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-93-314-61-801000

    110-93-314-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    104-11-652-41-770000

    104-11-652-41-770000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    104-11-652-41-770000

    Таблицы данных

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-306-61-001000

    116-43-306-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    115-44-624-61-003000

    115-44-624-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-3508-211

    24-3508-211

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    RFQ
    24-3508-211

    Таблицы данных

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    24-3508-311

    24-3508-311

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    RFQ
    24-3508-311

    Таблицы данных

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    240-4846-00-3303

    240-4846-00-3303

    CONN IC DIP SOCKET ZIF 40POS GLD

    3M

    0
    RFQ
    240-4846-00-3303

    Таблицы данных

    OEM Bulk Obsolete DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 250.0µin (6.35µm) Beryllium Copper Polyether Imide (PEI), Glass Filled -55°C ~ 105°C
    614-41-950-31-002000

    614-41-950-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-41-950-31-002000

    Таблицы данных

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-950-31-002000

    614-91-950-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-91-950-31-002000

    Таблицы данных

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-324-61-001000

    110-91-324-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-424-61-001000

    110-91-424-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-91-624-61-001000

    110-91-624-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-950-31-007000

    614-41-950-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-41-950-31-007000

    Таблицы данных

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-950-31-007000

    614-91-950-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-91-950-31-007000

    Таблицы данных

    614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    36-6621-30

    36-6621-30

    CONN IC DIP SOCKET 36POS TIN

    Aries Electronics

    0
    RFQ
    36-6621-30

    Таблицы данных

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    144-PGM13095-10

    144-PGM13095-10

    CONN SOCKET PGA GOLD

    Aries Electronics

    0
    RFQ
    144-PGM13095-10

    Таблицы данных

    PGM Bulk Active PGA - 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    517-87-411-20-111111

    517-87-411-20-111111

    CONN SOCKET PGA 411POS GOLD

    Preci-Dip

    0
    RFQ
    517-87-411-20-111111

    Таблицы данных

    517 Bulk Active PGA 411 (20 x 20) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    104-13-640-41-780000

    104-13-640-41-780000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    104-13-640-41-780000

    Таблицы данных

    104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic -
    116-41-950-41-007000

    116-41-950-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-41-950-41-007000

    Таблицы данных

    116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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