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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    36-6556-20

    36-6556-20

    CONN IC DIP SOCKET 36POS GOLD

    Aries Electronics

    0
    RFQ
    36-6556-20

    Таблицы данных

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    30-6621-30

    30-6621-30

    CONN IC DIP SOCKET 30POS TIN

    Aries Electronics

    0
    RFQ
    30-6621-30

    Таблицы данных

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    40-7950-10

    40-7950-10

    CONN SOCKET SIP 40POS TIN

    Aries Electronics

    0
    RFQ
    40-7950-10

    Таблицы данных

    700 Elevator Strip-Line™ Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-41-636-31-002000

    614-41-636-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-41-636-31-002000

    Таблицы данных

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-636-31-002000

    614-91-636-31-002000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-91-636-31-002000

    Таблицы данных

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-47-650-41-007000

    116-47-650-41-007000

    STANDRD SOLDRTL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    116-47-650-41-007000

    Таблицы данных

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-41-636-31-007000

    614-41-636-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-41-636-31-007000

    Таблицы данных

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-91-636-31-007000

    614-91-636-31-007000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    0
    RFQ
    614-91-636-31-007000

    Таблицы данных

    614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APA-318-G-Q

    APA-318-G-Q

    ADAPTER PLUG

    Samtec Inc.

    0
    RFQ
    APA-318-G-Q

    Таблицы данных

    APA Tube Active - 18 (2 x 9) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    40-3575-10

    40-3575-10

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    0
    RFQ
    40-3575-10

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6571-10

    40-6571-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    0
    RFQ
    40-6571-10

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6573-10

    40-6573-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    0
    RFQ
    40-6573-10

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-6575-10

    40-6575-10

    CONN IC DIP SOCKET ZIF 40POS TIN

    Aries Electronics

    0
    RFQ
    40-6575-10

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    HLS-0414-S-2

    HLS-0414-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0414-S-2

    Таблицы данных

    HLS Bulk Active SIP 56 (4 x 14) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    32-6575-10

    32-6575-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    0
    RFQ
    32-6575-10

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6574-10

    32-6574-10

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    0
    RFQ
    32-6574-10

    Таблицы данных

    57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    126-41-636-41-001000

    126-41-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    126-41-636-41-001000

    Таблицы данных

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-91-636-41-001000

    126-91-636-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    0
    RFQ
    126-91-636-41-001000

    Таблицы данных

    126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    517-87-364-17-091111

    517-87-364-17-091111

    CONN SOCKET PGA 364POS GOLD

    Preci-Dip

    0
    RFQ
    517-87-364-17-091111

    Таблицы данных

    517 Bulk Active PGA 364 (17 x 17) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-8350-610C

    28-8350-610C

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-8350-610C

    Таблицы данных

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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