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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    48-6554-11

    48-6554-11

    CONN IC DIP SOCKET ZIF 48POS GLD

    Aries Electronics

    97
    RFQ
    48-6554-11

    Таблицы данных

    55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    220-2600-00-0602

    220-2600-00-0602

    CONN SOCKET SIP ZIF 20POS GOLD

    3M

    4
    RFQ
    220-2600-00-0602

    Таблицы данных

    Textool™ Bulk Active SIP, ZIF (ZIP) 20 (1 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    236-6225-00-0602

    236-6225-00-0602

    CONN SOCKET SIP ZIF 36POS GOLD

    3M

    6
    RFQ
    236-6225-00-0602

    Таблицы данных

    Textool™ Bulk Active SIP, ZIF (ZIP) 36 (1 x 36) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled -55°C ~ 125°C
    248-5205-01

    248-5205-01

    CONN SOCKET QFN 48POS GOLD

    3M

    4
    RFQ
    248-5205-01

    Таблицы данных

    Textool™ Bulk Active QFN 48 (4 x 12) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Beryllium Copper Polyethersulfone (PES) -
    264-5205-01

    264-5205-01

    CONN SOCKET QFN 64POS GOLD

    3M

    21
    RFQ
    264-5205-01

    Таблицы данных

    Textool™ Bulk Active QFN 64 (4 x 16) 0.020" (0.50mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.020" (0.50mm) Gold - Beryllium Copper Polyethersulfone (PES) -
    441-PRS21001-12

    441-PRS21001-12

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    19
    RFQ
    441-PRS21001-12

    Таблицы данных

    PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    288-4205-01

    288-4205-01

    CONN SOCKET QFN 88POS GOLD

    3M

    11
    RFQ
    288-4205-01

    Таблицы данных

    Textool™ Bulk Active QFN 88 (4 x 22) 0.016" (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016" (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES) -
    ICS-624-T

    ICS-624-T

    IC SOCKET, DIP, 24P 2.54MM PITCH

    Adam Tech

    791
    RFQ
    ICS-624-T

    Таблицы данных

    ICS Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    ED06DT

    ED06DT

    CONN IC DIP SOCKET 6POS TIN

    On Shore Technology Inc.

    470
    RFQ
    ED06DT

    Таблицы данных

    ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
    ICS-632-T

    ICS-632-T

    IC SOCKET, DIP, 32P 2.54MM PITCH

    Adam Tech

    801
    RFQ
    ICS-632-T

    Таблицы данных

    ICS Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    ED32DT

    ED32DT

    CONN IC DIP SOCKET 32POS TIN

    On Shore Technology Inc.

    879
    RFQ
    ED32DT

    Таблицы данных

    ED Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
    ICM-306-1-GT-HT

    ICM-306-1-GT-HT

    MACHINE PIN SOCKET, IC, DIP, 6P

    Adam Tech

    770
    RFQ
    ICM-306-1-GT-HT

    Таблицы данных

    ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    A 24-LC/7-T

    A 24-LC/7-T

    CONN IC DIP SOCKET 24POS TIN

    Assmann WSW Components

    707
    RFQ
    A 24-LC/7-T

    Таблицы данных

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    A 22-LC-T2

    A 22-LC-T2

    CONN IC DIP SOCKET 22POS TIN

    Assmann WSW Components

    687
    RFQ
    A 22-LC-T2

    Таблицы данных

    - Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    A 20-LC-TR

    A 20-LC-TR

    CONN IC DIP SOCKET 20POS TIN

    Assmann WSW Components

    394
    RFQ
    A 20-LC-TR

    Таблицы данных

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    A 40-LC-TR

    A 40-LC-TR

    CONN IC DIP SOCKET 40POS TIN

    Assmann WSW Components

    143
    RFQ
    A 40-LC-TR

    Таблицы данных

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    245-32-1-06

    245-32-1-06

    CONN IC DIP SOCKET 32POS TIN

    CNC Tech

    873
    RFQ
    245-32-1-06

    Таблицы данных

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    A 32-LC-TT

    A 32-LC-TT

    CONN IC DIP SOCKET 32POS TIN

    Assmann WSW Components

    845
    RFQ
    A 32-LC-TT

    Таблицы данных

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
    4820-3004-CP

    4820-3004-CP

    CONN IC DIP SOCKET 20POS TIN

    3M

    534
    RFQ
    4820-3004-CP

    Таблицы данных

    4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
    114-87-308-41-134161

    114-87-308-41-134161

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    827
    RFQ
    114-87-308-41-134161

    Таблицы данных

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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