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    Гнезда для ИС

    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    PGA175H010B5-1620R

    PGA175H010B5-1620R

    PGA SOCKET 175 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    PGA175H010B5-1620R

    Таблицы данных

    - - Active PGA 175 (16 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Open Frame - - - - - - -
    APO-318-T-T

    APO-318-T-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    20-8865-310C

    20-8865-310C

    CONN ELEVATOR SOCKET 20 PO .300

    Aries Electronics

    0
    RFQ

    -

    8 - Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-83-632-10-002101

    299-83-632-10-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    0
    RFQ
    299-83-632-10-002101

    Таблицы данных

    299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    28-3518-10E

    28-3518-10E

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-3518-10E

    Таблицы данных

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-6820-90

    18-6820-90

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    0
    RFQ
    18-6820-90

    Таблицы данных

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    ICO-632-NGT

    ICO-632-NGT

    CONN IC DIP SOCKET 32POS GOLD

    Samtec Inc.

    0
    RFQ
    ICO-632-NGT

    Таблицы данных

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    346-93-139-41-013000

    346-93-139-41-013000

    CONN SOCKET SIP 39POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-93-139-41-013000

    Таблицы данных

    346 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-139-41-013000

    346-43-139-41-013000

    CONN SOCKET SIP 39POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-43-139-41-013000

    Таблицы данных

    346 Bulk Active SIP 39 (1 x 39) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    24-0503-30

    24-0503-30

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    0
    RFQ
    24-0503-30

    Таблицы данных

    0503 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-3508-302

    20-3508-302

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-3508-302

    Таблицы данных

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-202

    14-3508-202

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-3508-202

    Таблицы данных

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3508-302

    14-3508-302

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-3508-302

    Таблицы данных

    508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    APO-318-G-A

    APO-318-G-A

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    APO-318-G-A

    Таблицы данных

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    ICO-324-MGG

    ICO-324-MGG

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-324-MGG

    Таблицы данных

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    299-93-624-10-002000

    299-93-624-10-002000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    299-93-624-10-002000

    Таблицы данных

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-624-10-002000

    299-43-624-10-002000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    299-43-624-10-002000

    Таблицы данных

    299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0311-T-11

    HLS-0311-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0311-T-11

    Таблицы данных

    HLS Tube Active SIP 33 (3 x 11) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    32-6501-20

    32-6501-20

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    0
    RFQ
    32-6501-20

    Таблицы данных

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    32-6501-30

    32-6501-30

    CONN IC DIP SOCKET 32POS TIN

    Aries Electronics

    0
    RFQ
    32-6501-30

    Таблицы данных

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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