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    Гнезда для ИС

    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    08-8900-310C

    08-8900-310C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-8900-310C

    Таблицы данных

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-8937-610C

    08-8937-610C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-8937-610C

    Таблицы данных

    8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-6513-11

    28-6513-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    0
    RFQ
    28-6513-11

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-3518-10E

    14-3518-10E

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-3518-10E

    Таблицы данных

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-650-41-006101

    116-83-650-41-006101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-650-41-006101

    Таблицы данных

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    8114LB603

    8114LB603

    THM,11692 REV J

    Boyd Laconia, LLC

    0
    RFQ

    -

    - Bulk Active - - - - - - - - - - - - - - -
    117-87-668-41-105101

    117-87-668-41-105101

    CONN IC DIP SOCKET 68POS GOLD

    Preci-Dip

    0
    RFQ
    117-87-668-41-105101

    Таблицы данных

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-WGG-3

    ICA-308-WGG-3

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-308-WGG-3

    Таблицы данных

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-624-ZSST

    ICA-624-ZSST

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-624-ZSST

    Таблицы данных

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
    HLS-0314-TT-2

    HLS-0314-TT-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0314-TT-2

    Таблицы данных

    HLS Tube Active SIP 42 (3 x 14) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    08-6501-21

    08-6501-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-6501-21

    Таблицы данных

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-87-650-41-007101

    116-87-650-41-007101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-650-41-007101

    Таблицы данных

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    346-93-119-41-013000

    346-93-119-41-013000

    CONN SOCKET SIP 19POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-93-119-41-013000

    Таблицы данных

    346 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    346-43-119-41-013000

    346-43-119-41-013000

    CONN SOCKET SIP 19POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    346-43-119-41-013000

    Таблицы данных

    346 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    ICF-328-S-O-TR

    ICF-328-S-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    0
    RFQ
    ICF-328-S-O-TR

    Таблицы данных

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    08-6501-31

    08-6501-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-6501-31

    Таблицы данных

    501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    08-0508-21

    08-0508-21

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-0508-21

    Таблицы данных

    508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-0508-31

    08-0508-31

    CONN SOCKET SIP 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-0508-31

    Таблицы данных

    508 Bulk Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-1508-21

    08-1508-21

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-1508-21

    Таблицы данных

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    08-1508-31

    08-1508-31

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-1508-31

    Таблицы данных

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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