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    Гнезда для ИС

    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    123-87-650-41-001101

    123-87-650-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    0
    RFQ
    123-87-650-41-001101

    Таблицы данных

    123 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0310-TT-22

    HLS-0310-TT-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0310-TT-22

    Таблицы данных

    HLS Tube Active SIP 30 (3 x 10) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    614-83-950-31-012101

    614-83-950-31-012101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    0
    RFQ
    614-83-950-31-012101

    Таблицы данных

    614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-0511-11

    02-0511-11

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-0511-11

    Таблицы данных

    511 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    06-2503-21

    06-2503-21

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    0
    RFQ
    06-2503-21

    Таблицы данных

    503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    06-2503-31

    06-2503-31

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    0
    RFQ
    06-2503-31

    Таблицы данных

    503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    12-6503-20

    12-6503-20

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-6503-20

    Таблицы данных

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-6503-30

    12-6503-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-6503-30

    Таблицы данных

    503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-0517-90C

    16-0517-90C

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-0517-90C

    Таблицы данных

    0517 Bulk Active SIP 16 (1 x 16) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - Solder - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    146-83-640-41-035101

    146-83-640-41-035101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    0
    RFQ
    146-83-640-41-035101

    Таблицы данных

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-83-640-41-036101

    146-83-640-41-036101

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    0
    RFQ
    146-83-640-41-036101

    Таблицы данных

    146 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PGA168H008B5-1706R

    PGA168H008B5-1706R

    PGA SOCKET 168 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    PGA168H008B5-1706R

    Таблицы данных

    - - Active PGA 168 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
    124-83-432-41-002101

    124-83-432-41-002101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    0
    RFQ

    -

    124 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0116-T-10

    HLS-0116-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0116-T-10

    Таблицы данных

    HLS Tube Active SIP 16 (1 x 16) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    4594

    4594

    CONN SOCKET TRANSIST TO100 10POS

    Keystone Electronics

    0
    RFQ
    4594

    Таблицы данных

    - Bulk Active Transistor, TO-100 10 (Round) - Tin - Brass Chassis Mount Closed Frame Solder - Tin - Brass Polyester, Glass Filled -
    116-83-648-41-006101

    116-83-648-41-006101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-648-41-006101

    Таблицы данных

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    13-0511-10

    13-0511-10

    CONN SOCKET SIP 13POS TIN

    Aries Electronics

    0
    RFQ
    13-0511-10

    Таблицы данных

    511 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    510-87-159-16-071101

    510-87-159-16-071101

    CONN SOCKET PGA 159POS GOLD

    Preci-Dip

    0
    RFQ
    510-87-159-16-071101

    Таблицы данных

    510 Bulk Active PGA 159 (16 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-648-41-007101

    116-87-648-41-007101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-648-41-007101

    Таблицы данных

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0112-G-2

    HLS-0112-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0112-G-2

    Таблицы данных

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
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