Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
05-0513-10HCONN SOCKET SIP 5POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
0513 | Bulk | Active | SIP | 5 (1 x 5) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
06-6513-10CONN IC DIP SOCKET 6POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
![]() |
08-3513-10TCONN IC DIP SOCKET 8POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
![]() |
08-6513-10TCONN IC DIP SOCKET 8POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
![]() |
07-0518-00CONN SOCKET SIP 7POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
11-0518-10TCONN SOCKET SIP 11POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | SIP | 11 (1 x 11) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
06-3518-11CONN IC DIP SOCKET 6POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
518 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
08-0513-10TCONN SOCKET SIP 8POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
0513 | Bulk | Active | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
09-0513-10CONN SOCKET SIP 9POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
0513 | Bulk | Active | SIP | 9 (1 x 9) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
10-0513-10TCONN SOCKET SIP 10POS GOLD Aries Electronics |
0 |
|
![]() Таблицы данных |
0513 | Bulk | Active | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |