Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
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13-7970-10CONN SOCKET SIP 13POS TIN Aries Electronics |
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![]() Таблицы данных |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 13 (1 x 13) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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38-3513-11CONN IC DIP SOCKET 38POS GOLD Aries Electronics |
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![]() Таблицы данных |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 38 (2 x 19) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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15-0503-21CONN SOCKET SIP 15POS GOLD Aries Electronics |
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![]() Таблицы данных |
0503 | Bulk | Active | SIP | 15 (1 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
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15-0503-31CONN SOCKET SIP 15POS GOLD Aries Electronics |
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![]() Таблицы данных |
0503 | Bulk | Active | SIP | 15 (1 x 15) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
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22-0508-20CONN SOCKET SIP 22POS GOLD Aries Electronics |
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![]() Таблицы данных |
508 | Bulk | Active | SIP | 22 (1 x 22) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
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22-0508-30CONN SOCKET SIP 22POS GOLD Aries Electronics |
0 |
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![]() Таблицы данных |
508 | Bulk | Active | SIP | 22 (1 x 22) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
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22-1508-30CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
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![]() Таблицы данных |
508 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 22 (2 x 11) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 | -55°C ~ 105°C |
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18-0501-20CONN SOCKET SIP 18POS TIN Aries Electronics |
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![]() Таблицы данных |
501 | Bulk | Active | SIP | 18 (1 x 18) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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18-0501-30CONN SOCKET SIP 18POS TIN Aries Electronics |
0 |
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![]() Таблицы данных |
501 | Bulk | Active | SIP | 18 (1 x 18) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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20-4508-20CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
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![]() Таблицы данных |
508 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |