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    Гнезда для ИС

    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    10-0503-30

    10-0503-30

    CONN SOCKET SIP 10POS GOLD

    Aries Electronics

    0
    RFQ
    10-0503-30

    Таблицы данных

    0503 Bulk Active SIP 10 (1 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    20-0518-11H

    20-0518-11H

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-0518-11H

    Таблицы данных

    518 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    34-0518-11

    34-0518-11

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    0
    RFQ
    34-0518-11

    Таблицы данных

    518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-648-41-105101

    110-83-648-41-105101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-648-41-105101

    Таблицы данных

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    550-80-037-10-061101

    550-80-037-10-061101

    PGA SOLDER TAIL

    Preci-Dip

    0
    RFQ
    550-80-037-10-061101

    Таблицы данных

    550 Bulk Active PGA 37 (10 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0205-G-11

    HLS-0205-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0205-G-11

    Таблицы данных

    HLS Tube Active SIP 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-83-632-41-008101

    116-83-632-41-008101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-632-41-008101

    Таблицы данных

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-072-11-001101

    510-83-072-11-001101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-072-11-001101

    Таблицы данных

    510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-83-072-11-041101

    510-83-072-11-041101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-072-11-041101

    Таблицы данных

    510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    C9124-00

    C9124-00

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    RFQ
    C9124-00

    Таблицы данных

    Edge-Grip™, C91 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    22-4513-11

    22-4513-11

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    0
    RFQ
    22-4513-11

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    299-83-318-11-001101

    299-83-318-11-001101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    0
    RFQ
    299-83-318-11-001101

    Таблицы данных

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-322-SGT

    ICO-322-SGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-322-SGT

    Таблицы данных

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-422-WTT

    ICA-422-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-422-WTT

    Таблицы данных

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICA-322-SGT

    ICA-322-SGT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-322-SGT

    Таблицы данных

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-322-WTT

    ICA-322-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-322-WTT

    Таблицы данных

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    29-0518-11

    29-0518-11

    CONN SOCKET SIP 29POS GOLD

    Aries Electronics

    0
    RFQ
    29-0518-11

    Таблицы данных

    518 Bulk Active SIP 29 (1 x 29) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-652-31-012101

    614-87-652-31-012101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    0
    RFQ
    614-87-652-31-012101

    Таблицы данных

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-87-950-41-001101

    612-87-950-41-001101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    0
    RFQ
    612-87-950-41-001101

    Таблицы данных

    612 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    32-6518-00

    32-6518-00

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    0
    RFQ
    32-6518-00

    Таблицы данных

    518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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