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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    AR 52-HZL/07-TT

    AR 52-HZL/07-TT

    SOCKET

    Assmann WSW Components

    0
    RFQ

    -

    AR Bulk Active DIP, 0.9" (22.86mm) Row Spacing 52 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    214-44-314-01-670799

    214-44-314-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    214-99-314-01-670799

    214-99-314-01-670799

    STANDRD SOLDER TAIL DIP SOCKET

    Mill-Max Manufacturing Corp.

    0
    RFQ

    -

    214 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    20-3518-10M

    20-3518-10M

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-3518-10M

    Таблицы данных

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-83-432-41-001101

    612-83-432-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    0
    RFQ
    612-83-432-41-001101

    Таблицы данных

    612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-107-12-051101

    510-87-107-12-051101

    CONN SOCKET PGA 107POS GOLD

    Preci-Dip

    0
    RFQ
    510-87-107-12-051101

    Таблицы данных

    510 Bulk Active PGA 107 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-648-41-005101

    117-83-648-41-005101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    0
    RFQ
    117-83-648-41-005101

    Таблицы данных

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2134146-3

    2134146-3

    CONN SOCKET PGA 989POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    2134146-3

    Таблицы данных

    - Tape & Reel (TR) Obsolete PGA 989 (35 x 36) 0.157" (4.00mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.157" (4.00mm) Tin-Lead Flash Copper Alloy Thermoplastic -
    A-ICS-254-28-TT50

    A-ICS-254-28-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    0
    RFQ
    A-ICS-254-28-TT50

    Таблицы данных

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    116-83-328-41-007101

    116-83-328-41-007101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-328-41-007101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    04-0501-21

    04-0501-21

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    0
    RFQ
    04-0501-21

    Таблицы данных

    501 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    04-0501-31

    04-0501-31

    CONN SOCKET SIP 4POS GOLD

    Aries Electronics

    0
    RFQ
    04-0501-31

    Таблицы данных

    501 Bulk Active SIP 4 (1 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    20-3513-00

    20-3513-00

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-3513-00

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    09-0503-30

    09-0503-30

    CONN SOCKET SIP 9POS GOLD

    Aries Electronics

    0
    RFQ
    09-0503-30

    Таблицы данных

    0503 Bulk Active SIP 9 (1 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    18-0518-11H

    18-0518-11H

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    0
    RFQ
    18-0518-11H

    Таблицы данных

    518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-1518-11H

    18-1518-11H

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    0
    RFQ
    18-1518-11H

    Таблицы данных

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    11-0508-20

    11-0508-20

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    0
    RFQ
    11-0508-20

    Таблицы данных

    508 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    11-0508-30

    11-0508-30

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    0
    RFQ
    11-0508-30

    Таблицы данных

    508 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    16-3518-101H

    16-3518-101H

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-3518-101H

    Таблицы данных

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    117-93-620-41-005000

    117-93-620-41-005000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    117-93-620-41-005000

    Таблицы данных

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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