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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    116-87-422-41-009101

    116-87-422-41-009101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-422-41-009101

    Таблицы данных

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    514-AG12D-LF

    514-AG12D-LF

    CONN IC DIP SOCKET 14POS TIN

    TE Connectivity AMP Connectors

    0
    RFQ
    514-AG12D-LF

    Таблицы данных

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    22-3513-10

    22-3513-10

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    0
    RFQ
    22-3513-10

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-210-41-013101

    116-83-210-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-210-41-013101

    Таблицы данных

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-640-41-001151

    110-83-640-41-001151

    CONN IC DIP SOCKET 40POS GOLD

    Preci-Dip

    0
    RFQ

    -

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame, No Center Bar Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-328-41-006101

    116-83-328-41-006101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-328-41-006101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-0513-10

    24-0513-10

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    0
    RFQ
    24-0513-10

    Таблицы данных

    0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0203-G-11

    HLS-0203-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0203-G-11

    Таблицы данных

    HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-83-420-41-008101

    116-83-420-41-008101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-420-41-008101

    Таблицы данных

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AR 28-HZL/01-7-TT

    AR 28-HZL/01-7-TT

    SOCKET

    Assmann WSW Components

    0
    RFQ

    -

    AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    510-87-072-11-001101

    510-87-072-11-001101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    0
    RFQ
    510-87-072-11-001101

    Таблицы данных

    510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-072-11-041101

    510-87-072-11-041101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    0
    RFQ
    510-87-072-11-041101

    Таблицы данных

    510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-87-072-11-061101

    510-87-072-11-061101

    CONN SOCKET PGA 72POS GOLD

    Preci-Dip

    0
    RFQ
    510-87-072-11-061101

    Таблицы данных

    510 Bulk Active PGA 72 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-032-TM-N-TR

    PLCC-032-TM-N-TR

    CONN SOCKET PLCC 32POS TIN

    Samtec Inc.

    0
    RFQ
    PLCC-032-TM-N-TR

    Таблицы данных

    PLCC Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    A-ICS-254-20-TT50

    A-ICS-254-20-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    0
    RFQ
    A-ICS-254-20-TT50

    Таблицы данных

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    ICO-324-STT

    ICO-324-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-324-STT

    Таблицы данных

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-624-STT

    ICO-624-STT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    0
    RFQ
    ICO-624-STT

    Таблицы данных

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    12-1518-00

    12-1518-00

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-1518-00

    Таблицы данных

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    25-0518-10

    25-0518-10

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    0
    RFQ
    25-0518-10

    Таблицы данных

    518 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-310-41-013101

    116-83-310-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-310-41-013101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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