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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    116-87-428-41-003101

    116-87-428-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-428-41-003101

    Таблицы данных

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-628-41-003101

    115-83-628-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    115-83-628-41-003101

    Таблицы данных

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1814643-8

    1814643-8

    CONN IC DIP SOCKET 10POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    1814643-8

    Таблицы данных

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) - - Brass Thermoplastic, Polyester -55°C ~ 125°C
    146-87-322-41-035101

    146-87-322-41-035101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    146-87-322-41-035101

    Таблицы данных

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X28-160B

    SIP050-1X28-160B

    1X28-160B-SIP SOCKET 28 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X28-160B

    Таблицы данных

    SIP050-1x Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    917-43-108-41-001000

    917-43-108-41-001000

    CONN TRANSIST TO-5 8POS GOLD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    917-43-108-41-001000

    Таблицы данных

    917 Tube Active Transistor, TO-5 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    917-43-208-41-001000

    917-43-208-41-001000

    CONN SOCKET TRANSIST TO-100 8POS

    Mill-Max Manufacturing Corp.

    0
    RFQ
    917-43-208-41-001000

    Таблицы данных

    917 Tube Active Transistor, TO-100 8 (Round) - Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-87-420-41-002101

    116-87-420-41-002101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-420-41-002101

    Таблицы данных

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-0513-10

    20-0513-10

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-0513-10

    Таблицы данных

    0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-0513-10T

    22-0513-10T

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    0
    RFQ
    22-0513-10T

    Таблицы данных

    0513 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-318-41-007101

    116-83-318-41-007101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-318-41-007101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0204-T-2

    HLS-0204-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0204-T-2

    Таблицы данных

    HLS Tube Active SIP 8 (2 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    114-87-642-41-117101

    114-87-642-41-117101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    0
    RFQ
    114-87-642-41-117101

    Таблицы данных

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-642-41-134161

    114-87-642-41-134161

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    0
    RFQ
    114-87-642-41-134161

    Таблицы данных

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-322-41-008101

    116-87-322-41-008101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-322-41-008101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-620-41-105101

    117-83-620-41-105101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    117-83-620-41-105101

    Таблицы данных

    117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D01-9951642

    D01-9951642

    CONN SOCKET SIP 16POS GOLD

    Harwin Inc.

    0
    RFQ
    D01-9951642

    Таблицы данных

    D01-995 Tube Obsolete SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-310-41-013101

    116-87-310-41-013101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-310-41-013101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-312-41-004101

    116-83-312-41-004101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-312-41-004101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-320-41-003101

    116-83-320-41-003101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-320-41-003101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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