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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    116-87-324-41-012101

    116-87-324-41-012101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-324-41-012101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-87-420-41-001101

    123-87-420-41-001101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    123-87-420-41-001101

    Таблицы данных

    123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-312-41-105191

    110-83-312-41-105191

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ

    -

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    13-0513-10H

    13-0513-10H

    CONN SOCKET SIP 13POS GOLD

    Aries Electronics

    0
    RFQ
    13-0513-10H

    Таблицы данных

    0513 Bulk Active SIP 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-0513-10T

    20-0513-10T

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    0
    RFQ
    20-0513-10T

    Таблицы данных

    0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    5-1571552-0

    5-1571552-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    5-1571552-0

    Таблицы данных

    800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    ICF-314-TL-I-TR

    ICF-314-TL-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    0
    RFQ
    ICF-314-TL-I-TR

    Таблицы данных

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    114-83-624-41-117101

    114-83-624-41-117101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    114-83-624-41-117101

    Таблицы данных

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-624-41-134161

    114-83-624-41-134161

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    114-83-624-41-134161

    Таблицы данных

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0303-T-2

    HLS-0303-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0303-T-2

    Таблицы данных

    HLS Tube Active SIP 9 (3 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICA-308-WTT

    ICA-308-WTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    0
    RFQ
    ICA-308-WTT

    Таблицы данных

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    614-87-328-31-012101

    614-87-328-31-012101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    614-87-328-31-012101

    Таблицы данных

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-320-31-012101

    614-83-320-31-012101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    614-83-320-31-012101

    Таблицы данных

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-83-420-31-012101

    614-83-420-31-012101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    614-83-420-31-012101

    Таблицы данных

    614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-428-31-012101

    614-87-428-31-012101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    614-87-428-31-012101

    Таблицы данных

    614 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-210-41-011101

    116-83-210-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-210-41-011101

    Таблицы данных

    116 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0518-10T

    18-0518-10T

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    0
    RFQ
    18-0518-10T

    Таблицы данных

    518 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-83-316-41-002101

    116-83-316-41-002101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-316-41-002101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-0511-10

    02-0511-10

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    0
    RFQ
    02-0511-10

    Таблицы данных

    511 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    04-3513-11H

    04-3513-11H

    CONN IC DIP SOCKET 4POS GOLD

    Aries Electronics

    0
    RFQ
    04-3513-11H

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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