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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    110-87-636-41-005101

    110-87-636-41-005101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-636-41-005101

    Таблицы данных

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X23-157B

    SIP050-1X23-157B

    1X23-157B-SIP SOCKET 23 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X23-157B

    Таблицы данных

    SIP050-1x Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    116-87-312-41-011101

    116-87-312-41-011101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-312-41-011101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    12-3513-10T

    12-3513-10T

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-3513-10T

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    612-87-324-41-001101

    612-87-324-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    612-87-324-41-001101

    Таблицы данных

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-422-41-005101

    110-83-422-41-005101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-422-41-005101

    Таблицы данных

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-422-41-605101

    110-83-422-41-605101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-422-41-605101

    Таблицы данных

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-322-41-018101

    116-87-322-41-018101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-322-41-018101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0103-G-38

    HLS-0103-G-38

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0103-G-38

    Таблицы данных

    HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    211-1-40-006

    211-1-40-006

    CONN IC DIP SOCKET 40POS GOLD

    CNC Tech

    0
    RFQ
    211-1-40-006

    Таблицы данных

    - Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    122-83-312-41-001101

    122-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ
    122-83-312-41-001101

    Таблицы данных

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    643647-1

    643647-1

    CONN SOCKET SIP 15POS TIN

    TE Connectivity AMP Connectors

    0
    RFQ
    643647-1

    Таблицы данных

    Diplomate DL Tray Obsolete SIP 15 (1 x 15) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    510-83-028-06-001101

    510-83-028-06-001101

    CONN SOCKET PGA 28POS GOLD

    Preci-Dip

    0
    RFQ
    510-83-028-06-001101

    Таблицы данных

    510 Bulk Active PGA 28 (6 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    643653-1

    643653-1

    CONN SOCKET SIP 21POS TIN

    TE Connectivity AMP Connectors

    0
    RFQ

    -

    Diplomate DL Box Obsolete SIP 21 (1 x 21) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 105°C
    110-87-320-41-105191

    110-87-320-41-105191

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ

    -

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    822516-5

    822516-5

    CONN SOCKET PLCC 68POS TIN

    TE Connectivity AMP Connectors

    0
    RFQ
    822516-5

    Таблицы данных

    - Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    114-83-316-41-134191

    114-83-316-41-134191

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ
    114-83-316-41-134191

    Таблицы данных

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    808-AG11D

    808-AG11D

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    808-AG11D

    Таблицы данных

    800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 80.0µin (2.03µm) Copper Alloy Polyester -55°C ~ 105°C
    2-1571550-3

    2-1571550-3

    CONN IC DIP SOCKET 14POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    2-1571550-3

    Таблицы данных

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    508-AG10D-ES

    508-AG10D-ES

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ
    508-AG10D-ES

    Таблицы данных

    500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy Polyester -55°C ~ 125°C
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