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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    146-87-314-41-035101

    146-87-314-41-035101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    146-87-314-41-035101

    Таблицы данных

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    146-87-314-41-036101

    146-87-314-41-036101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    146-87-314-41-036101

    Таблицы данных

    146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X21-157B

    SIP050-1X21-157B

    1X21-157B-SIP SOCKET 21 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X21-157B

    Таблицы данных

    SIP050-1x Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    410-87-228-10-001101

    410-87-228-10-001101

    CONN ZIG-ZAG 28POS GOLD

    Preci-Dip

    0
    RFQ
    410-87-228-10-001101

    Таблицы данных

    410 Bulk Active Zig-Zag, Left Stackable 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    410-87-228-10-002101

    410-87-228-10-002101

    CONN ZIG-ZAG 28POS GOLD

    Preci-Dip

    0
    RFQ
    410-87-228-10-002101

    Таблицы данных

    410 Bulk Active Zig-Zag, Right Stackable 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-008101

    116-87-314-41-008101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-314-41-008101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP1X27-001B

    SIP1X27-001B

    SIP1X27-001B-SIP SOCKET 27 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP1X27-001B

    Таблицы данных

    SIP1x Bulk Active SIP 27 (1 x 27) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    AR64-HZL-TT

    AR64-HZL-TT

    CONN IC DIP SOCKET 64POS TIN

    Assmann WSW Components

    0
    RFQ
    AR64-HZL-TT

    Таблицы данных

    - Bag Obsolete DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    917-83-108-41-053101

    917-83-108-41-053101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    0
    RFQ
    917-83-108-41-053101

    Таблицы данных

    917 Bulk Active Transistor, TO-5 8 (Round) - Gold 29.5µin (0.75µm) Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-3518-10M

    08-3518-10M

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-3518-10M

    Таблицы данных

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    06-2513-11

    06-2513-11

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    0
    RFQ
    06-2513-11

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-1518-10T

    16-1518-10T

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-1518-10T

    Таблицы данных

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    612-87-322-41-001101

    612-87-322-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    0
    RFQ
    612-87-322-41-001101

    Таблицы данных

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    SIP050-1X18-160B

    SIP050-1X18-160B

    1X18-160B-SIP SOCKET 18 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X18-160B

    Таблицы данных

    SIP050-1x Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    400-028-000

    400-028-000

    CONN IC DIP SOCKET 28POS GOLD

    3M

    0
    RFQ

    -

    400 - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    917-87-210-41-053101

    917-87-210-41-053101

    CONN TRANSIST TO-5 10POS GOLD

    Preci-Dip

    0
    RFQ
    917-87-210-41-053101

    Таблицы данных

    917 Bulk Active Transistor, TO-5 10 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-316-41-105191

    110-87-316-41-105191

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ

    -

    110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-610-41-009101

    116-83-610-41-009101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-610-41-009101

    Таблицы данных

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    08-3513-11

    08-3513-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-3513-11

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-308-41-011101

    116-83-308-41-011101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-308-41-011101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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