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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    115-87-328-41-001101

    115-87-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ

    -

    115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-3518-10T

    24-3518-10T

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    RFQ
    24-3518-10T

    Таблицы данных

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    917-87-108-41-005101

    917-87-108-41-005101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    0
    RFQ
    917-87-108-41-005101

    Таблицы данных

    917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    917-87-208-41-005101

    917-87-208-41-005101

    CONN TRANSIST TO-5 8POS GOLD

    Preci-Dip

    0
    RFQ
    917-87-208-41-005101

    Таблицы данных

    917 Bulk Active Transistor, TO-5 8 (Round) - Gold Flash Beryllium Copper Through Hole - Solder - Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-318-31-012101

    614-87-318-31-012101

    CONN IC DIP SOCKET 18POS GOLD

    Preci-Dip

    0
    RFQ
    614-87-318-31-012101

    Таблицы данных

    614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-314-41-007101

    116-87-314-41-007101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-314-41-007101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    A 28-LC-TR01

    A 28-LC-TR01

    28 (2 X 14) POS DIP, 0.3" (7.62M

    Assmann WSW Components

    0
    RFQ
    A 28-LC-TR01

    Таблицы данных

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 105°C
    08-6513-11

    08-6513-11

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-6513-11

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    A-ICS-254-10-TT50

    A-ICS-254-10-TT50

    IC SOCKET, MACHINED PIN, 7.62MM,

    Assmann WSW Components

    0
    RFQ
    A-ICS-254-10-TT50

    Таблицы данных

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 0.100" (2.54mm) Nickel 78.7µin (2.00µm) Beryllium Copper Through Hole, Right Angle Open Frame Solder 0.100" (2.54mm) Tin 78.7µin (2.00µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    08-3518-10H

    08-3518-10H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-3518-10H

    Таблицы данных

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    D01-9950942

    D01-9950942

    CONN SOCKET SIP 9POS GOLD

    Harwin Inc.

    0
    RFQ
    D01-9950942

    Таблицы данных

    D01-995 Tube Obsolete SIP 9 (1 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    02-6513-10

    02-6513-10

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-6513-10

    Таблицы данных

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-87-320-41-105161

    110-87-320-41-105161

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-320-41-105161

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D0814-01

    D0814-01

    CONN IC DIP SOCKET 14POS GOLD

    Harwin Inc.

    0
    RFQ
    D0814-01

    Таблицы данных

    D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-324-41-117101

    114-87-324-41-117101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    114-87-324-41-117101

    Таблицы данных

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-432-41-005101

    110-87-432-41-005101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-432-41-005101

    Таблицы данных

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-428-41-001101

    115-87-428-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ

    -

    115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-610-41-011101

    116-87-610-41-011101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-610-41-011101

    Таблицы данных

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-306-41-013101

    116-87-306-41-013101

    CONN IC DIP SOCKET 6POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-306-41-013101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    11-0518-11

    11-0518-11

    CONN SOCKET SIP 11POS GOLD

    Aries Electronics

    0
    RFQ
    11-0518-11

    Таблицы данных

    518 Bulk Active SIP 11 (1 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
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