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    制造商 Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Фотографии Производитель. Часть # Доступность Price Количество Таблицы данных Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
    116-87-310-41-003101

    116-87-310-41-003101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-310-41-003101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    614-87-210-41-001101

    614-87-210-41-001101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    614-87-210-41-001101

    Таблицы данных

    614 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    1825410-8

    1825410-8

    CONN SOCKET SIP 8POS GOLD

    TE Connectivity AMP Connectors

    0
    RFQ

    -

    Diplomate DL Tray Obsolete SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    110-87-312-41-105101

    110-87-312-41-105101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-312-41-105101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    AW 127-40/Z-T

    AW 127-40/Z-T

    SOCKET 40 CONTACTS SINGLE ROW

    Assmann WSW Components

    0
    RFQ
    AW 127-40/Z-T

    Таблицы данных

    - - Active - - - - - - - - - - - - - - -
    SIP1X21-011B

    SIP1X21-011B

    SIP1X21-011B-SIP SOCKET 21 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP1X21-011B

    Таблицы данных

    SIP1x Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    614-87-610-31-012101

    614-87-610-31-012101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    614-87-610-31-012101

    Таблицы данных

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    3-822516-3

    3-822516-3

    CONN SOCKET PLCC 20POS TIN

    TE Connectivity AMP Connectors

    0
    RFQ
    3-822516-3

    Таблицы данных

    - Tape & Reel (TR) Obsolete PLCC 20 (4 x 5) 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 100.0µin (2.54µm) Phosphor Bronze Thermoplastic -
    116-87-308-41-007101

    116-87-308-41-007101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-308-41-007101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-314-10-001101

    110-83-314-10-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-314-10-001101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-210-41-005101

    110-83-210-41-005101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-210-41-005101

    Таблицы данных

    110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-316-01-931101

    110-87-316-01-931101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-316-01-931101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-87-316-10-003101

    110-87-316-10-003101

    CONN IC DIP SOCKET 16POS GOLD

    Preci-Dip

    0
    RFQ
    110-87-316-10-003101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8), 8 Loaded 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-308-41-006101

    116-83-308-41-006101

    CONN IC DIP SOCKET 8POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-308-41-006101

    Таблицы данных

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-312-41-001101

    110-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-312-41-001101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    D0808-01

    D0808-01

    CONN IC DIP SOCKET 8POS GOLD

    Harwin Inc.

    0
    RFQ
    D0808-01

    Таблицы данных

    D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 196.9µin (5.00µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-0513-10

    06-0513-10

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    0
    RFQ
    06-0513-10

    Таблицы данных

    0513 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0508-20

    02-0508-20

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-0508-20

    Таблицы данных

    508 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    02-1508-20

    02-1508-20

    CONN IC DIP SOCKET 2POS GOLD

    Aries Electronics

    0
    RFQ
    02-1508-20

    Таблицы данных

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    110-83-310-41-005101

    110-83-310-41-005101

    CONN IC DIP SOCKET 10POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-310-41-005101

    Таблицы данных

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
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