Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Стиль | Количество положений | Количество загруженных позиций | Шаг - Сопряжение | Количество рядов | Расстояние между рядами - Сопряжение | Тип крепления | Оконечная нагрузка | Тип крепления | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Цвет изоляции | Высота изоляции | Длина контакта - Пост | Рабочая температура | Степень воспламеняемости материала | Высота сопряженного стекирования | Защита от проникновения | Особенности | Номинальный ток (Ампер) |
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CLP-139-02-H-D-BE-PLOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
0 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 78 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Pick and Place | 3.3A per Contact |
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CLP-140-02-SM-D-BE-ALOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
0 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 80 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide | 3.3A per Contact |
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YTQ-126-03-H-Q-0502.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc. |
0 |
|
![]() Таблицы данных |
YTQ | Tube | Active | Socket | Forked | Board to Board | 104 | 103 | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.250" (6.35mm) | 0.208" (5.28mm) | -55°C ~ 125°C | - | - | - | - | - |
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CLP-134-02-H-D-PLOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
0 |
|
- |
CLP | - | Active | Receptacle | Female Socket | Board to Board | 68 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Pick and Place | 3.3A per Contact |
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CLP-134-02-H-D-PALOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
0 |
|
- |
CLP | - | Active | Receptacle | Female Socket | Board to Board | 68 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide, Pick and Place | 3.3A per Contact |
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CLT-137-02-H-D-KLOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
0 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-129-02-H-D-ALOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
0 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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YTE-120-02-G-6-7102.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
0 |
|
![]() Таблицы данных |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 120 | All | 0.079" (2.00mm) | 6 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.710" (18.03mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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YTE-120-02-G-6-7502.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
0 |
|
![]() Таблицы данных |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 120 | All | 0.079" (2.00mm) | 6 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.750" (19.05mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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CLM-125-02-H-D-PALOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc. |
0 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |