Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Стиль | Количество положений | Количество загруженных позиций | Шаг - Сопряжение | Количество рядов | Расстояние между рядами - Сопряжение | Тип крепления | Оконечная нагрузка | Тип крепления | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Цвет изоляции | Высота изоляции | Длина контакта - Пост | Рабочая температура | Степень воспламеняемости материала | Высота сопряженного стекирования | Защита от проникновения | Особенности | Номинальный ток (Ампер) |
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ESD-136-T-28CONN SOCKET 72POS 0.1 GOLD PCB Samtec Inc. |
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![]() Таблицы данных |
ESD | Bulk | Active | Elevated Socket | Female Socket | Board to Board | 72 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.300" (7.62mm) | 0.365" (9.27mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - |
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YTE-130-03-M-Q-368-1172.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
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![]() Таблицы данных |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 120 | 119 | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.368" (9.35mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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ESQT-150-03-M-Q-310CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc. |
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![]() Таблицы данных |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.310" (7.87mm) | 0.148" (3.76mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-M-Q-340CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.340" (8.64mm) | 0.118" (3.00mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-M-Q-350CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.350" (8.89mm) | 0.108" (2.75mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-M-Q-360CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.360" (9.14mm) | 0.098" (2.50mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-M-Q-365CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.365" (9.27mm) | 0.093" (2.35mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-M-Q-368CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.368" (9.35mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-M-Q-385CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.385" (9.78mm) | 0.073" (1.85mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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BCS-125-H-D-HEPASS-THROUGH SOCKET STRIP, 0.100 Samtec Inc. |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |