Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Стиль | Количество положений | Количество загруженных позиций | Шаг - Сопряжение | Количество рядов | Расстояние между рядами - Сопряжение | Тип крепления | Оконечная нагрузка | Тип крепления | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Цвет изоляции | Высота изоляции | Длина контакта - Пост | Рабочая температура | Степень воспламеняемости материала | Высота сопряженного стекирования | Защита от проникновения | Особенности | Номинальный ток (Ампер) |
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ESQT-150-03-G-D-358CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.358" (9.10mm) | 0.100" (2.54mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-G-D-360CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.360" (9.14mm) | 0.098" (2.50mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-G-D-368CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.368" (9.35mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-G-D-379CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.379" (9.63mm) | 0.079" (2.00mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-126-02-G-Q-700CONN SOCKET 104P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 104 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.700" (17.78mm) | 0.150" (3.81mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-126-02-G-Q-730CONN SOCKET 104P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 104 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.730" (18.54mm) | 0.120" (3.05mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-126-02-G-Q-740CONN SOCKET 104P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 104 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.740" (18.80mm) | 0.110" (2.79mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-126-02-G-Q-790CONN SOCKET 104P 0.079 GOLD PCB Samtec Inc. |
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ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 104 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.790" (20.07mm) | 0.060" (1.52mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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CLT-128-02-LM-D-BE-A-KLOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLP-116-02-H-D-PALOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
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CLP | - | Active | Receptacle | Female Socket | Board to Board | 32 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide, Pick and Place | 3.3A per Contact |