| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Стиль | Количество положений | Количество загруженных позиций | Шаг - Сопряжение | Количество рядов | Расстояние между рядами - Сопряжение | Тип крепления | Оконечная нагрузка | Тип крепления | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Цвет изоляции | Высота изоляции | Длина контакта - Пост | Рабочая температура | Степень воспламеняемости материала | Высота сопряженного стекирования | Защита от проникновения | Особенности | Номинальный ток (Ампер) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CLP-124-02-LTL-D-BE-ALOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
0 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 48 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide | 3.3A per Contact |
|
CLT-127-02-S-D-ALOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
0 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
BCS-139-F-D-DEPASS-THROUGH SOCKET STRIP, 0.100 Samtec Inc. |
0 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
CLP-113-02-H-D-A-PLOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
0 |
|
- |
CLP | - | Active | Receptacle | Female Socket | Board to Board | 26 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide, Pick and Place | 3.3A per Contact |
|
FOLC-105-01-L-QCONN RCPT 20POS 0.05 GOLD PCB Samtec Inc. |
0 |
|
- |
FOURRAY™ FOLC | Tube | Active | Receptacle | Female Socket | Board to Board | 20 | All | 0.050" (1.27mm) | 4 | 0.050" (1.27mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.180" (4.57mm) | 0.075" (1.91mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 2.6A per Contact |
|
BSW-133-24-S-DCONN RCPT 66POS 0.1 GOLD PCB Samtec Inc. |
0 |
|
Таблицы данных |
BSW | Bulk | Active | Receptacle, Breakaway | Female Socket | Board to Board | 66 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole, Bottom Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.350" (8.89mm) | 0.165" (4.19mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - |
|
ESQT-130-02-M-D-500CONN SOCKET 60POS 0.079 GOLD PCB Samtec Inc. |
0 |
|
- |
ESQT | Bulk | Active | Elevated Socket | Forked | Board to Board or Cable | 60 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.500" (12.70mm) | 0.350" (8.89mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESS-125-G-24CONN SOCKET 25POS 0.1 GOLD PCB Samtec Inc. |
0 |
|
Таблицы данных |
ESS | Bulk | Active | Elevated Socket | Female Socket | Board to Board | 25 | All | 0.100" (2.54mm) | 1 | - | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.400" (10.16mm) | 0.123" (3.12mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - |
|
CLP-124-02-FM-D-BE-ALOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
0 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 48 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 3.00µin (0.076µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide | 3.3A per Contact |
|
CLM-113-02-G-D-BELOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc. |
0 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |