| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Стиль | Количество положений | Количество загруженных позиций | Шаг - Сопряжение | Количество рядов | Расстояние между рядами - Сопряжение | Тип крепления | Оконечная нагрузка | Тип крепления | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Цвет изоляции | Высота изоляции | Длина контакта - Пост | Рабочая температура | Степень воспламеняемости материала | Высота сопряженного стекирования | Защита от проникновения | Особенности | Номинальный ток (Ампер) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
CLT-127-02-LM-D-A-PLOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
0 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
BCS-115-H-D-TEPASS-THROUGH SOCKET STRIP, 0.100 Samtec Inc. |
0 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
QST-125-03-F-T2.00 MM POWER PLANE SOCKET STRIP Samtec Inc. |
0 |
|
Таблицы данных |
QST | Tube | Active | Receptacle | Female Socket | Board to Board | 75 | All | 0.079" (2.00mm) | 3 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 3.00µin (0.076µm) | Black | 0.650" (16.50mm) | 0.090" (2.29mm) | -55°C ~ 125°C | - | - | - | - | - |
|
ESQT-130-03-L-Q-309CONN SOCKET 120P 0.079 GOLD PCB Samtec Inc. |
0 |
|
- |
ESQT | Bulk | Active | Elevated Socket | Forked | Board to Board or Cable | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.309" (7.85mm) | 0.149" (3.78mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-130-03-L-Q-332CONN SOCKET 120P 0.079 GOLD PCB Samtec Inc. |
0 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.332" (8.43mm) | 0.126" (3.20mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-130-03-L-Q-335CONN SOCKET 120P 0.079 GOLD PCB Samtec Inc. |
0 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.335" (8.51mm) | 0.123" (3.12mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-130-03-L-Q-345CONN SOCKET 120P 0.079 GOLD PCB Samtec Inc. |
0 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.345" (8.76mm) | 0.113" (2.87mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-130-03-L-Q-350CONN SOCKET 120P 0.079 GOLD PCB Samtec Inc. |
0 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.350" (8.89mm) | 0.108" (2.75mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-130-03-L-Q-368CONN SOCKET 120P 0.079 GOLD PCB Samtec Inc. |
0 |
|
Таблицы данных |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.368" (9.35mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-130-03-L-Q-370CONN SOCKET 120P 0.079 GOLD PCB Samtec Inc. |
0 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.370" (9.40mm) | 0.088" (2.23mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |