БОМ
Разъемы, штыревые контакты
| Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Номинальный ток (Ампер) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SLM N 1 063 12 GStraight, narrow insulator |
0 |
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Таблицы данных |
SLM N 1 063 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 12 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.248" (6.30mm) | 0.122" (3.10mm) | 0.437" (11.10mm) | 0.067" (1.70mm) | Square | Gold | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Narrow Insulator | 1.5A |
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SLM N 1 092 15 ZStraight, narrow insulator |
0 |
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Таблицы данных |
SLM N 1 092 | - | Active | Header | Male Pin | 0.050" (1.27mm) | 15 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.362" (9.20mm) | 0.122" (3.10mm) | 0.551" (14.00mm) | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Narrow Insulator | 1.5A |
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SLM N 1 063 13 GStraight, narrow insulator |
0 |
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Таблицы данных |
SLM N 1 063 | - | Active | Header | Male Pin | 0.050" (1.27mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.248" (6.30mm) | 0.122" (3.10mm) | 0.437" (11.10mm) | 0.067" (1.70mm) | Square | Gold | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Narrow Insulator | 1.5A |
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SLV W 2 036 30 Zpitch 1.27 x 2.54 mm; suitable f |
0 |
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Таблицы данных |
SLV W 2 036 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 30 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.098" (2.50mm) | 0.307" (7.80mm) | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLM N 1 117 17 ZStraight, narrow insulator |
0 |
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Таблицы данных |
SLM N 1 117 | - | Active | Header | Male Pin | 0.050" (1.27mm) | 17 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.461" (11.70mm) | 0.122" (3.10mm) | 0.650" (16.50mm) | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Narrow Insulator | 1.5A |
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SLM N 11 117 7 GStraight, narrow insulator |
0 |
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Таблицы данных |
SLM N 11 117 | - | Active | Header | Male Pin | 0.050" (1.27mm) | 7 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.189" (4.80mm) | 0.189" (4.80mm) | 0.717" (18.20mm) | 0.067" (1.70mm) | Square | Gold | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Narrow Insulator | 1.5A |
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SLV W 2 KA 054 38 Zpitch 1.27 x 2.54 mm; suitable f |
0 |
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Таблицы данных |
SLV W 2 KA 054 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 38 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.213" (5.40mm) | - | - | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 22 055 44 Zpitch 1.27 x 2.54 mm; suitable f |
0 |
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Таблицы данных |
SLV W 22 055 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 44 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.217" (5.50mm) | 0.197" (5.00mm) | 0.480" (12.20mm) | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 2 SMD 048 60 Gpitch 1.27 x 2.54 mm; two rows, |
0 |
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Таблицы данных |
SLV W 2 SMD 048 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 60 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.189" (4.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 22 080 68 Zpitch 1.27 x 2.54 mm; suitable f |
0 |
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Таблицы данных |
SLV W 22 080 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 68 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.315" (8.00mm) | 0.197" (5.00mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 1 SMD 073 6 Gone row, wide isolation body, 4- |
0 |
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Таблицы данных |
SLV W 1 SMD 073 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.287" (7.30mm) | - | - | 0.067" (1.70mm) | Square | Gold | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 22 055 64 Zpitch 1.27 x 2.54 mm; suitable f |
0 |
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Таблицы данных |
SLV W 22 055 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 64 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.217" (5.50mm) | 0.197" (5.00mm) | 0.480" (12.20mm) | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 2 KA 030 48 Zpitch 1.27 x 2.54 mm; suitable f |
0 |
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Таблицы данных |
SLV W 2 KA 030 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 48 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | - | - | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLM N 11 063 15 GStraight, narrow insulator |
0 |
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Таблицы данных |
SLM N 11 063 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 15 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.248" (6.30mm) | 0.189" (4.80mm) | 0.504" (12.80mm) | 0.067" (1.70mm) | Square | Gold | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Narrow Insulator | 1.5A |
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SLV W 2 080 50 Zpitch 1.27 x 2.54 mm; suitable f |
0 |
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Таблицы данных |
SLV W 2 080 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.315" (8.00mm) | 0.098" (2.50mm) | 0.480" (12.20mm) | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 2 SMD 048 24 Gpitch 1.27 x 2.54 mm; two rows, |
0 |
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Таблицы данных |
SLV W 2 SMD 048 | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 24 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.189" (4.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 2 130 50 Zpitch 1.27 x 2.54 mm; suitable f |
0 |
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Таблицы данных |
SLV W 2 130 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 50 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.512" (13.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 2 KA 030 4 Gpitch 1.27 x 2.54 mm; suitable f |
0 |
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Таблицы данных |
SLV W 2 KA 030 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 4 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | - | - | 0.067" (1.70mm) | Square | Gold | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 2 080 60 Zpitch 1.27 x 2.54 mm; suitable f |
0 |
|
Таблицы данных |
SLV W 2 080 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 60 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.315" (8.00mm) | 0.098" (2.50mm) | 0.480" (12.20mm) | 0.067" (1.70mm) | Square | Tin | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
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SLV W 22 080 20 Gpitch 1.27 x 2.54 mm; suitable f |
0 |
|
Таблицы данных |
SLV W 22 080 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.315" (8.00mm) | 0.197" (5.00mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | 1.5A |
