Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Корпус/корпус | Упаковка | Состояние продукта | Применение | Ток - Питание | Напряжение - Питание | Рабочая температура | Марка | Квалификация | Тип крепления | Устройство поставщика Упаковка |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33PF3000A3ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
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MC33PF3000A4ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
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MC33PF3000A5ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
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MC33PF3000A6ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |
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MC33FS8410G3ESR2SYSTEM BASIS CHIP FS8410 NXP USA Inc. |
0 |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
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MC33FS8410G6ESR2SYSTEM BASIS CHIP FS8410 NXP USA Inc. |
0 |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
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MFS2603AMDA0ADR2SAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | - | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MFS2633AMBA0ADR2SAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | 29µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MC33FS6502NAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4502CAER2SYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |