Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Корпус/корпус | Упаковка | Состояние продукта | Применение | Ток - Питание | Напряжение - Питание | Рабочая температура | Марка | Квалификация | Тип крепления | Устройство поставщика Упаковка |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200DFESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200DHESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200ESESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
![]() |
MC33PF8200CXESR2POWER MANAGEMENT IC I.MX8 PRE-PR NXP USA Inc. |
0 |
|
![]() Таблицы данных |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |