Фотографии | Производитель. Часть # | Доступность | Количество | Таблицы данных | Серия | Упаковка | Состояние продукта | Тип карты | Пол | Количество позиций/отсек/ряд | Количество положений | Толщина карты | Количество рядов | Шаг | Считать | Особенности | Тип крепления | Оконечная нагрузка | Материал контакта | Покрытие контакта | Толщина покрытия контакта | Тип контакта | Цвет | Характеристика фланца | Рабочая температура |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
HSEC8-125-01-L-DV-A-BL-K-TRCONN EDGE DUAL FMALE 50POS 0.031 Samtec Inc. |
250 |
|
![]() Таблицы данных |
Edge Rate™ HSEC8 | Tape & Reel (TR) | Active | Non Specified - Dual Edge | Female | 25 | 50 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Board Lock | Surface Mount | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-120-01-L-DV-A-PECONN EDGE DUAL FMALE 40POS 0.031 Samtec Inc. |
242 |
|
![]() Таблицы данных |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 20 | 40 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
|
MEC8-110-01-L-DV-ACONN EDGE DUAL FMALE 20POS 0.031 Samtec Inc. |
17 |
|
![]() Таблицы данных |
MEC8 - DV | Tray | Active | Non Specified - Dual Edge | Female | 10 | 20 | 0.039" (1.00mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Through Hole | Press-Fit | Copper | Gold | 10.0µin (0.25µm) | - | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-113-01-S-DV-A-KCONN EDGE DUAL FMALE 26POS 0.031 Samtec Inc. |
125 |
|
![]() Таблицы данных |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 13 | 26 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount | Solder | Beryllium Copper | Gold | 30.0µin (0.76µm) | Cantilever | Black | - | -55°C ~ 125°C |
![]() |
HTEC8-130-01-L-DV-A-K-TR0.80 MM RUGGED HIGH-SPEED EDGE C Samtec Inc. |
532 |
|
![]() Таблицы данных |
Edge Rate™ HTEC8 | Tape & Reel (TR) | Active | Non Specified - Dual Edge | Female | 30 | 60 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Pick and Place | Surface Mount | Solder | Copper Alloy | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
![]() |
MB1-120-01-L-S-01-SL-N1.00 MM MINI EDGE CARD SOCKET WI Samtec Inc. |
3 |
|
![]() Таблицы данных |
MB1 | Tube | Active | Non Specified - Single Edge | Female | - | 20 | 0.031" (0.79mm) | 1 | 0.039" (1.00mm) | Single | Board Guide, Card Guide | Surface Mount, Right Angle | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Loop Bellows | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-130-01-S-DV-A-KCONN EDGE DUAL FMALE 60POS 0.031 Samtec Inc. |
115 |
|
![]() Таблицы данных |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 30 | 60 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount | Solder | Beryllium Copper | Gold | 30.0µin (0.76µm) | Cantilever | Black | - | -55°C ~ 125°C |
![]() |
HTEC8-130-01-S-DV-A-K-TR0.80 MM RUGGED HIGH-SPEED EDGE C Samtec Inc. |
530 |
|
![]() Таблицы данных |
Edge Rate™ HTEC8 | Tape & Reel (TR) | Active | Non Specified - Dual Edge | Female | 30 | 60 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Pick and Place | Surface Mount | Solder | Copper Alloy | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
|
MEC8-110-02-SM-DV-A-K-TRCONN EDGE DUAL FMALE 20POS 0.031 Samtec Inc. |
400 |
|
![]() Таблицы данных |
MEC8 - DV | Tape & Reel (TR) | Active | Non Specified - Dual Edge | Female | 10 | 20 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount | Solder | Phosphor Bronze | Gold | 30.0µin (0.76µm) | Hairpin Bellows | Black | - | -55°C ~ 125°C |
![]() |
HSEC8-130-01-S-DV-A-WT-KCONN EDGE DUAL FMALE 60POS 0.031 Samtec Inc. |
140 |
|
![]() Таблицы данных |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 30 | 60 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Solder Retention | Surface Mount | Solder | Beryllium Copper | Gold | 30.0µin (0.76µm) | Cantilever | Black | - | -55°C ~ 125°C |